Design and modeling methodology of embedded passives substrate in a compact wireless connectivity module

A novel wireless connectivity module by using embedded high dielectric constant (Dk) material in a 6 layer build-up substrate to form the passive circuit is presented. The module shows 18% size shrinking while embedded BPF, Balun and Divider circuit. The embedded BPF and Balun show 2 dB and 1 dB insertion loss at passband respectively. An efficient design methodology is demonstrated for high performance and yield prediction. It shows good correlation between design and measurement validation. In this study, the packaging level reliability test is proceeded to investigate the function degradation after aging process. It is suggested the embedded circuit design margin should include manufacturing tolerance, pattern deform and material property change after aging process.