Title :
Parameter extraction guidelines for hot-electron reliability simulation
Author :
Chan, Vei-Han ; Kim, Jeffery S. ; Chung, James E.
Author_Institution :
Microsyst. Technol., Lab., MIT, Cambridge, MA, USA
Abstract :
Detailed NMOSFET parameter extraction guidelines for the hot-electron degradation models used in many circuit-level reliability simulation tools are proposed. Accurate calibration of these models to a particular technology is shown to require accounting for the asymptotic and variable power-law time dependence of hot-electron degradation, and the impact of the local oxide electric field on the critical energy for interface damage. In addition, statistical analysis is used to determine the prediction intervals within which hot-electron lifetime can be estimated, and to offer insight into developing more efficient and precise testing methodologies.<>
Keywords :
CMOS integrated circuits; VLSI; carrier lifetime; circuit reliability; hot carriers; insulated gate field effect transistors; semiconductor device models; semiconductor device testing; CMOS; NMOSFET; VLSI; asymptotic dependence; calibration; circuit-level reliability simulation tools; critical energy; hot-electron degradation models; hot-electron lifetime; hot-electron reliability simulation; interface damage; local oxide electric field; parameter extraction guidelines; statistical analysis; testing methodologies; variable power-law time dependence; Calibration; Circuit simulation; Degradation; Guidelines; Life estimation; Life testing; Lifetime estimation; MOSFET circuits; Parameter extraction; Statistical analysis;
Conference_Titel :
Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-0782-8
DOI :
10.1109/RELPHY.1993.283306