• DocumentCode
    1726879
  • Title

    Empirical software simulation for COTS glue code development and integration

  • Author

    Baik, Jongmoon ; Eickelmann, Nancy ; Abts, Chris

  • Author_Institution
    Motorola Inc., Schaumburg, IL, USA
  • fYear
    2001
  • fDate
    6/23/1905 12:00:00 AM
  • Firstpage
    297
  • Lastpage
    302
  • Abstract
    The use of COTS (commercial-off-the-shelf) components for system development has been a growing trend in the software engineering community during the past decade. However, the engineering of COTS-based systems involves significant technical risks. A good indicator of the as yet unresolved difficulties in COTS-based system developments is the relatively poor understanding frequently regarding the processes associated with development of the "glue code" used to integrate COTS components into the system, as well as with the other integration activities. The main objective of the paper is to understand how the glue code development process and the COTS component integration process affect each other and how they affect development effort and schedule throughout the development life cycle, based on given parameters via software simulation that provides a method for checking the understanding of the real world process and thus help people produce better results in the future
  • Keywords
    computer aided software engineering; digital simulation; integrated software; software engineering; COTS; commercial-off-the-shelf components; components integration; development life cycle; empirical software simulation; glue code development; real world process; technical risks; Concurrent computing; Plugs; Product design; Programming; Protocols; Security; Software engineering; Software systems; Systems engineering and theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Software and Applications Conference, 2001. COMPSAC 2001. 25th Annual International
  • Conference_Location
    Chicago, IL
  • ISSN
    0730-3157
  • Print_ISBN
    0-7695-1372-7
  • Type

    conf

  • DOI
    10.1109/CMPSAC.2001.960630
  • Filename
    960630