DocumentCode :
1727056
Title :
How can high mobility channel materials boost or degrade performance in advanced CMOS
Author :
Skotnicki, Thomas ; Boeuf, Frederic
Author_Institution :
STMicroelectronics, Crolles, France
fYear :
2010
Firstpage :
153
Lastpage :
154
Abstract :
Big hopes are still placed in high mobility materials such as III-V compound semiconductors. The key new elements that may moderate this belief are: degradation of DIBL, subthreshold slope and gate capacitance due to larger dielectric constant and smaller density of states in III-V materials. We will show how DIBL plays directly on performance, especially in LP technologies. This effect is now for the first time taken into account along with all other degradation sources associated with III-V channels. As a result, the gain in performance turns out to be much smaller than the expected 2X, and even become negative. This analysis also shows in which applications and conditions, the III-V channels exhibit their strengths the best.
Keywords :
CMOS integrated circuits; III-V semiconductors; carrier mobility; integrated circuit reliability; CMOS; DIBL degradation; III-V channels; drain induced barrier lowering; gate capacitance; high mobility channel material; subthreshold slope; CMOS integrated circuits; Degradation; Dielectric constant; International Electron Devices Meeting; Silicon; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology (VLSIT), 2010 Symposium on
Conference_Location :
Honolulu
Print_ISBN :
978-1-4244-5451-8
Electronic_ISBN :
978-1-4244-5450-1
Type :
conf
DOI :
10.1109/VLSIT.2010.5556208
Filename :
5556208
Link To Document :
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