Title :
A study on the reliability of the chip surface solder joint
Author :
Ikeda, Yoshinari ; Iizuka, Yuji ; Asai, Tatsuhiko ; Goto, Tomoaki ; Takahashi, Yoshikazu
Author_Institution :
Electron Device Lab., Fuji Electr. Device Technol. Co., Ltd., Nagano
Abstract :
The solder joint reliability of IGBT chip surface interconnection with a lead-frame structure is described in the power cycling (P/C) capability which is greatly improved due to a chip surface cooling effect in comparison with aluminum wire interconnection. The lead-frame is joined on a Ni and Au plated chip surface with Sn-Ag or Sn-Sb system solders. The P/C capability obtained with the Sn-Sb system solder is three times larger than that with the Sn-Ag system solder. Such a good performance comes from the solid solution hardening property of Sn-Sb system solder.
Keywords :
aluminium; gold; nickel; reliability; solders; tin compounds; Au; IGBT chip surface interconnection; Ni; Sn-Ag; Sn-Sb; aluminum wire interconnection; chip surface cooling; chip surface solder joint reliability; lead-frame structure; power cycling capability; solution hardening; Copper; Environmentally friendly manufacturing techniques; Insulated gate bipolar transistors; Integrated circuit interconnections; Lead; Power system interconnection; Power system reliability; Soldering; Temperature; Testing;
Conference_Titel :
Power Semiconductor Devices and IC's, 2008. ISPSD '08. 20th International Symposium on
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4244-1532-8
Electronic_ISBN :
978-1-4244-1533-5
DOI :
10.1109/ISPSD.2008.4538930
