A study on the reliability of the chip surface solder joint

Author

Ikeda, Yoshinari ; Iizuka, Yuji ; Asai, Tatsuhiko ; Goto, Tomoaki ; Takahashi, Yoshikazu

Author_Institution

Electron Device Lab., Fuji Electr. Device Technol. Co., Ltd., Nagano

fYear

2008

Firstpage

189

Lastpage

192

Abstract

The solder joint reliability of IGBT chip surface interconnection with a lead-frame structure is described in the power cycling (P/C) capability which is greatly improved due to a chip surface cooling effect in comparison with aluminum wire interconnection. The lead-frame is joined on a Ni and Au plated chip surface with Sn-Ag or Sn-Sb system solders. The P/C capability obtained with the Sn-Sb system solder is three times larger than that with the Sn-Ag system solder. Such a good performance comes from the solid solution hardening property of Sn-Sb system solder.

Keywords

aluminium; gold; nickel; reliability; solders; tin compounds; Au; IGBT chip surface interconnection; Ni; Sn-Ag; Sn-Sb; aluminum wire interconnection; chip surface cooling; chip surface solder joint reliability; lead-frame structure; power cycling capability; solution hardening; Copper; Environmentally friendly manufacturing techniques; Insulated gate bipolar transistors; Integrated circuit interconnections; Lead; Power system interconnection; Power system reliability; Soldering; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Semiconductor Devices and IC's, 2008. ISPSD '08. 20th International Symposium on

Conference_Location

Orlando, FL

Print_ISBN

978-1-4244-1532-8

Electronic_ISBN

978-1-4244-1533-5

Type

conf

DOI

10.1109/ISPSD.2008.4538930

Filename

4538930