Title :
Accelerated life performance of moisture damaged plastic surface mount devices
Author :
Shook, R.L. ; Conrad, T.R.
Author_Institution :
AT&T Bell Lab., Allentown, PA, USA
Abstract :
A study in which three manufacturers´ devices were moisture preconditioned and subjected to a simulated assembly process using both thermal and chemical exposures is discussed. C-mode scanning acoustic microscopy (C-SAM) was used to fully characterize the progress of internal delaminations and/or cracks for all parts. Results show significant temperature-humidity-bias life performance degradation for devices preconditioned with the higher levels of moisture preconditioning followed by chemical exposures. Moisture preconditioned devices with no chemical exposures show little life performance degradation. It was found that the C-SAM result of false healing on the leadframe fingers was correlated to the first to fail. Unbiased autoclave testing was found to be the least effective test for evaluating the life performance of moisture damaged devices.<>
Keywords :
acoustic microscopy; assembling; life testing; printed circuit testing; production testing; surface mount technology; C-SAM; C-mode scanning acoustic microscopy; autoclave testing; chemical exposures; internal delaminations; leadframe fingers; life performance degradation; moisture preconditioned; plastic surface mount devices; simulated assembly process; temperature-humidity-bias life performance degradation; thermal exposures; Acceleration; Acoustic devices; Assembly; Chemical processes; Life testing; Manufacturing processes; Moisture; Plastics; Surface cracks; Virtual manufacturing;
Conference_Titel :
Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-0782-8
DOI :
10.1109/RELPHY.1993.283320