• DocumentCode
    1727125
  • Title

    Moisture-induced gold ball bond degradation of polyimide-passivated devices in plastic packages

  • Author

    Shirley, C. Glenn ; De Guzman, M.S.

  • Author_Institution
    Intel Corp., Hillsboro, OR, USA
  • fYear
    1993
  • Firstpage
    217
  • Lastpage
    226
  • Abstract
    A mechanism of gold ball bond degradation in plastic packages is discussed. Polyimide die topcoat and moisture stress accelerate bond degradation. The mechanism is further accelerated by mistargeted bonds and low bonding parameters.<>
  • Keywords
    circuit reliability; gold; lead bonding; life testing; packaging; passivation; Au ball bond; ball bond degradation; bonding parameters; mistargeted bonds; moisture stress; plastic packages; polyimide die topcoat; polyimide-passivated devices; Bonding forces; Degradation; Gold; Humidity; Intermetallic; Plastic packaging; Polyimides; Stress; Testing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
  • Conference_Location
    Atlanta, GA, USA
  • Print_ISBN
    0-7803-0782-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.1993.283321
  • Filename
    283321
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1727125