Title :
Thermal cycling reliability of die bonding adhesives
Abstract :
A study of thermal cycling endurance of three different die attach adhesives by measuring the increase in thermal resistance during a thermal cycling test is discussed. Test chips were bonded to three substrates with different coefficients of thermal expansion. The thermal resistance increased with increased number of temperature cycles. A large mismatch in thermal expansion gave the fastest increase in thermal resistance. The study also revealed a significant difference in behavior between the different adhesives.<>
Keywords :
adhesion; monolithic integrated circuits; packaging; reliability; thermal expansion; thermal resistance; coefficients of thermal expansion; die attach; die bonding adhesives; mismatch; temperature cycles; thermal cycling endurance; thermal cycling test; thermal resistance; Bonding; Curing; Electrical resistance measurement; Microassembly; Silicon; Temperature; Testing; Thermal expansion; Thermal resistance; Thermal stresses;
Conference_Titel :
Reliability Physics Symposium, 1993. 31st Annual Proceedings., International
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-0782-8
DOI :
10.1109/RELPHY.1993.283323
