DocumentCode
1727347
Title
Capacity allocation in semiconductor fabrication
Author
Feigin, Gerald E. ; Katircioglu, Kaan ; Yao, David D.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Volume
2
fYear
1999
fDate
6/21/1905 12:00:00 AM
Firstpage
1374
Abstract
One of the most serious challenges in the semiconductor memory business is the rapid price decline. We develop an allocation scheme that determines the die (chip) allocation among different memory products. The allocation takes into account available die capacity, customer service requirements, as well as price declines and demand distributions among different products
Keywords
assembling; decision theory; optimisation; production control; resource allocation; wafer bonding; capacity allocation; chip allocation; customer service requirements; demand distributions; die allocation; die capacity; memory products; price decline; semiconductor fabrication; semiconductor memory; Assembly; Bonding; Consumer electronics; Costs; Customer service; Fabrication; Manufacturing; Semiconductor device manufacture; Semiconductor device packaging; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Decision and Control, 1999. Proceedings of the 38th IEEE Conference on
Conference_Location
Phoenix, AZ
ISSN
0191-2216
Print_ISBN
0-7803-5250-5
Type
conf
DOI
10.1109/CDC.1999.830144
Filename
830144
Link To Document