• DocumentCode
    1727442
  • Title

    Effects of particle size and amount of Al(OH)3 on silicone rubber for insulator

  • Author

    Park, H.Y. ; Kang, D.P. ; Ahn, M.S. ; Lee, T.H. ; Lee, D.I.

  • Author_Institution
    Adv. Electr. Mater. Res. Group, Korea Electrotechnol. Res. Inst., Changwon, South Korea
  • Volume
    2
  • fYear
    2004
  • Firstpage
    808
  • Abstract
    Silicone rubber has very excellent chemical stability and hydrophobicity. Silicone rubber has been used very much for housing materials of polymer insulator. Al(OH)3 is added to the silicone rubber for improvement of its resistance against surface discharge. Hydrophobicity recovery properties and arc resistance of silicone rubber could be different by the amount and particle size of Al(OH)3. In this paper, Al(OH)3 with different particle size was added to the silicone rubber during compounding. Silicone rubber was deteriorated by a corona treatment. Hydrophobicity recovery rate after corona treatment and arc resistance of silicone rubber were investigated. Hydrophobicity recovery rate of silicone rubber was evaluated by the measurement of contact angle. Arc resistance was evaluated by measuring weight loss of silicone rubber after arc resistance test. It was observed that the hydrophobicity recovery rate and arc resistance of silicone rubber were different according to different particle size and amount of Al(OH)3.
  • Keywords
    aluminium compounds; contact angle; particle size; plasma materials processing; polymer insulators; recovery; silicone rubber; surface treatment; Al(OH)3; arc resistance test; chemical stability; contact angle; corona treatment; housing materials; hydrophobicity; particle size; polymer insulator; recovery properties; recovery rate; silicone rubber; surface discharge; Chemicals; Corona; Electrical resistance measurement; Goniometers; Plastic insulation; Polymers; Rubber; Stability; Surface discharges; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics, 2004. ICSD 2004. Proceedings of the 2004 IEEE International Conference on
  • Print_ISBN
    0-7803-8348-6
  • Type

    conf

  • DOI
    10.1109/ICSD.2004.1350555
  • Filename
    1350555