DocumentCode :
1727470
Title :
The effect of the temperature on the Bipolar Degradation of 3.3 kV 4H-SiC PiN diodes
Author :
Brosselard, P. ; Tómas, A. Perez ; Camara, N. ; Hassan, J. ; Jordà, X. ; Vellvehi, M. ; Godignon, P. ; Millán, J. ; Bergman, J.P.
Author_Institution :
CNM-CSIC, Centro Nat. de Microelectron., Barcelona
fYear :
2008
Firstpage :
237
Lastpage :
240
Abstract :
Abstract- 4H-SiC PiN diodes have been manufactured on a Norstel epitaxied P+ZN/N* substrate with a combination of Mesa and JTE as edge termination. A breakdown voltage of 3.3 kV has been measured at lmuA regardless the active area (0.16 and 2.56 mm2). A differential on-resistance of 1.7 mOmega.cm2 was extracted at 15A-25degC. The recovery charge was only of 300 nC for a switched current of 15A at 300degC at a blocking voltage of 500V. 50% of the diodes exhibit a voltage shift of about IV, after a 60 hours DC- stress (25degC-225degC). The leakage current level remains unaffected after the DC stress.
Keywords :
avalanche diodes; bipolar integrated circuits; epitaxial layers; leakage currents; p-i-n diodes; substrates; switched current circuits; DC stress; Norstel; PiN diodes; bipolar degradation; blocking voltage; breakdown voltage; leakage current level; switched current; voltage shift; Anodes; Area measurement; Degradation; Leakage current; Manufacturing; Semiconductor diodes; Stress; Substrates; Temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and IC's, 2008. ISPSD '08. 20th International Symposium on
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4244-1532-8
Electronic_ISBN :
978-1-4244-1533-5
Type :
conf
DOI :
10.1109/ISPSD.2008.4538942
Filename :
4538942
Link To Document :
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