• DocumentCode
    1727781
  • Title

    An accurate and fast 3D numerical approach to power/signal and thermal co-simulation

  • Author

    Ai, Xin ; Kuo, An-Yu ; Baida, Mazen ; Chase, Yun

  • Author_Institution
    Sigrity, Inc., Campbell, CA, USA
  • fYear
    2011
  • Firstpage
    484
  • Lastpage
    487
  • Abstract
    As electronic designs are getting to a higher density and current level, demands for integration of power/signal and thermal analysis is growing. A 3D electrical/thermal co-simulation algorithm is presented in the paper. This approach provides very detailed solutions with high accuracy and efficiency.
  • Keywords
    circuit simulation; thermal analysis; three-dimensional integrated circuits; 3D electrical/thermal co-simulation algorithm; electronic designs; power/signal integration; thermal analysis; Conductivity; Finite element methods; Resistance heating; Temperature distribution; Thermal analysis; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-61284-497-8
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2011.5898555
  • Filename
    5898555
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1727781