Title :
High speed and low cost FOB (Film-on-Board) direct bonding using laser soldering technology
Author :
Hong, Soon-Min ; Choi, Won ; Koo, Ja-Myeng ; Choi, Won ; Moon, Young-Jun
Author_Institution :
Global Manuf. Technol. Center, Samsung Electron. Co., Ltd., Suwon, South Korea
Abstract :
The laser soldering was estimated for a high productivity and cost-effective FOB (Film-on-Board) bonding method. The local solder joint is rapidly heated up in laser soldering. The process can be optimized by laser power, beam scanning speed, scanning path, solder pre-coating condition, flux, and soldering fixture. It was possible to get enough peel strength, process yields, and reliability on the optimized laser soldering process condition. The two major failure modes in laser soldering were cold solder joint and burning of film.
Keywords :
bonding processes; integrated circuit reliability; laser materials processing; printed circuits; soldering equipment; FOB direct bonding method; beam scanning speed; failure mode; film burning; film-on-board direct bonding method; laser power; laser soldering technology; scanning path; solder joint; solder precoating condition; soldering fixture; Bonding; Films; Laser beams; Power lasers; Reliability; Semiconductor lasers; Soldering;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2011.5898563
