Title :
Investigations of the water-borne isotropically conductive adhesives
Author :
Yang, Cheng ; Yuen, Matthew M F ; Chen, Guohua ; Li, Zhongyu ; Wong, C.P.
Author_Institution :
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
Abstract :
Here we present the first study of the water-borne isotropically conductive adhesives (WBICAs) which exhibit electrical conductivity in 10-5 Q·cm, which exhibit many unique characters. For example, they are one-component materials with very long shelf-life; they are convenient in processing, strong in mechanical strength, highly reliable, environmentally benign, disposable, and compatible to various substrates for mass production without the need of thermal curing process. Due to the versatile mechanical characters of the polyurethane dispersant, the WBICAs can be used as interconnects or printed as circuits on various substrates. These materials underwent a 720 hrs temperature-humidity test showed no increase of electrical resistivity. We expect these materials will find applications in the new horizons of low-cost, low-carbon, disposable, and green electronic devices immediately.
Keywords :
conductive adhesives; curing; electrical conductivity; integrated circuit interconnections; mechanical strength; printed circuits; WBICA; electrical conductivity; interconnects; mass production; mechanical characters; mechanical strength; polyurethane dispersant; printed circuits; shelf-life; thermal curing; water-borne isotropically conductive adhesives; Conductivity; Printing; Resins; Resistance; Silver; Substrates;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2011.5898581