DocumentCode
1728318
Title
Investigations of the water-borne isotropically conductive adhesives
Author
Yang, Cheng ; Yuen, Matthew M F ; Chen, Guohua ; Li, Zhongyu ; Wong, C.P.
Author_Institution
Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
fYear
2011
Firstpage
645
Lastpage
650
Abstract
Here we present the first study of the water-borne isotropically conductive adhesives (WBICAs) which exhibit electrical conductivity in 10-5 Q·cm, which exhibit many unique characters. For example, they are one-component materials with very long shelf-life; they are convenient in processing, strong in mechanical strength, highly reliable, environmentally benign, disposable, and compatible to various substrates for mass production without the need of thermal curing process. Due to the versatile mechanical characters of the polyurethane dispersant, the WBICAs can be used as interconnects or printed as circuits on various substrates. These materials underwent a 720 hrs temperature-humidity test showed no increase of electrical resistivity. We expect these materials will find applications in the new horizons of low-cost, low-carbon, disposable, and green electronic devices immediately.
Keywords
conductive adhesives; curing; electrical conductivity; integrated circuit interconnections; mechanical strength; printed circuits; WBICA; electrical conductivity; interconnects; mass production; mechanical characters; mechanical strength; polyurethane dispersant; printed circuits; shelf-life; thermal curing; water-borne isotropically conductive adhesives; Conductivity; Printing; Resins; Resistance; Silver; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-61284-497-8
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2011.5898581
Filename
5898581
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