DocumentCode
1728357
Title
Nanofiber anisotropic conductive adhesives (ACAs) for ultra fine pitch chip-on-film (COF) packaging
Author
Suk, Kyoung-Lim ; Chung, Chang-Kyu ; Paik, Kyung-Wook
Author_Institution
Dept. of Mater. Sci. & Eng., KAIST, Daejeon, South Korea
fYear
2011
Firstpage
656
Lastpage
660
Abstract
Nanofiber ACFs composed of adhesive resins, conductive particles, and nanofibers were demonstrated for ultra fine pitch COF packages. PAN nanofibers and PAN nanofiber containing conductive particles inside the fibers were successfully produced using electrospinning methods. The effects of nanofiber thickness and structure on electrical properties of nanofiber ACFs were investigated.
Keywords
adhesives; chip-on-board packaging; nanofibres; adhesive resins; chip on film packaging; conductive particles; electrical properties; electrospinning methods; nanofiber anisotropic conductive adhesives; ultra fine pitch; Bonding; Insulation; Morphology; Needles; Polymers; Resins;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-61284-497-8
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2011.5898583
Filename
5898583
Link To Document