DocumentCode
1728492
Title
Angular accelerometer with dual anchor support
Author
O´Brien, G.J. ; Monk, D.J. ; Najafi, K.
Author_Institution
Sensor Products Div., Motorola Inc., Tempe, AZ, USA
Volume
2
fYear
2003
Firstpage
1371
Abstract
An angular accelerometer is demonstrated in 6 /spl mu/m thick silicon-on-insulator (SOI) with improved cross axis rejection using a dual anchor scheme. Dual anchor distribution is responsible for a 2X increase in the linear Z-Axis proof mass mechanical suspension spring constant while increasing the rotational spring constant by less than 15%. A structural framework of beams connected to the proof mass inner ring forms this floating hub, centrally anchored, cylindrical angular accelerometer. The floating hub significantly stiffens the proof mass structure resulting in a more robust sensor design to both process section and undesirable out of plane bending modes experienced during cross axis acceleration excitation. The open loop sensor angular acceleration sensitivity is 6 mV/r/s/sup 2/ with a resolution of 1 r/s/sup 2/ in a 250 Hz bandwidth for devices fabricated on 6 /spl mu/m thick SOI wafers. Mechanical deflection of the proof mass with reference to the fixed substrate anchor sites in a 1 g acceleration field is measured using a Zygo confocal 3D microscope as less than 0.041 /spl mu/m.
Keywords
acceleration measurement; accelerometers; angular measurement; elemental semiconductors; sensors; silicon-on-insulator; 250 Hz; 6 micron; Si-SiO/sub 2/; Zygo confocal 3D microscope; bending modes; cross axis acceleration excitation; cross axis rejection; cylindrical angular accelerometer; dual anchor support; floating hub; linear Z-Axis proof mass mechanical suspension spring constant; mechanical deflection; open loop sensor angular acceleration sensitivity; proof mass inner ring; robust sensor design; rotational spring constant; silicon-on-insulator; structural beam framework; substrate anchor sites; Acceleration; Accelerometers; Bandwidth; Mechanical sensors; Mechanical variables measurement; Microscopy; Process design; Robustness; Silicon on insulator technology; Springs;
fLanguage
English
Publisher
ieee
Conference_Titel
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7731-1
Type
conf
DOI
10.1109/SENSOR.2003.1217029
Filename
1217029
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