Title :
Development of surface micromachinable capacitive accelerometer using fringe electrical field
Author :
Aoyagi, S. ; Yu-Chong Tai
Author_Institution :
Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
Abstract :
This paper demonstrates a new type accelerometer, which consists of a dielectric seismic mass and comb-shaped planar capacitor underneath it. The simple structure of the device allows using polymer Parylene as the proof mass, so the technology is greatly simplified and only surface micromachining is required. Measuring principle is detecting capacitance change according to the dielectric mass movement in the fringe electrical field. This principle is verified by FEM simulation. Prototype accelerometers are fabricated and calibrated with the aid of off-chip capacitive readout IC.
Keywords :
accelerometers; calibration; capacitance; capacitors; electric field effects; finite element analysis; integrated circuit design; microsensors; polymers; readout electronics; FEM simulation; capacitance; comb shaped planar capacitor; dielectric seismic mass; fringe electrical field; off chip capacitive readout IC; polymer Parylene; prototype accelerometers; surface micromachinable capacitive accelerometer; surface micromachining; Accelerometers; Capacitance measurement; Capacitors; Dielectric measurements; Dielectric substrates; Electric variables measurement; Electrodes; Polymers; Seismic measurements; Wafer bonding;
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
DOI :
10.1109/SENSOR.2003.1217032