DocumentCode :
1728619
Title :
PA7300LC integrates cache for cost/performance
Author :
Hollenbeck, D. ; Undy, S.R. ; Johnson, L. ; Weiss, D. ; Tobin, P. ; Carlson, R.
Author_Institution :
Eng. Syst. Lab., Hewlett-Packard Co., Fort Collins, CO, USA
fYear :
1996
Firstpage :
167
Lastpage :
174
Abstract :
HP continues its development of low cost, high performance processors with an evolution of the PA7100LC which includes 128 kB of on-chip primary cache. It implements the full PA-RISC1.1 functionality including the little-endian, uncacheable memory, and multimedia extensions of the PA7100LC. The PA7300LC connects directly to an optional second level cache of 256 kB to 64 MB using plug-in cards. It also adds the ability to accelerate I/O stores to certain memory locations for greatly improved graphics performance. The cache system consists of on-chip, 2-way, separate instruction and data caches of 64 kB total each, plus the off-chip second level cache. Memory consists of 8 MB to 3.75 GB of standard DRAMs or SIMMs connecting directly to the processor chip, using either a 72 bit or 144 bit data path. The chip is fabricated in 0.5 micron, 4-level metal CMOS and is designed to run at frequencies up to 160 MHz. The PA7300LC exceeds performance levels of previous generation high-end workstations while lowering overall system cost and power consumption.
Keywords :
CMOS integrated circuits; microprocessor chips; reduced instruction set computing; CMOS IC; PA-RISC1.1 functionality; PA7100LC; PA7300LC; cache; cost/performance; high performance processors; multimedia extensions; on-chip primary cache; power consumption; system cost; Acceleration; Circuit testing; Cost function; Energy consumption; Frequency; Joining processes; Power generation; System-on-a-chip; Systems engineering and theory; Workstations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Compcon '96. 'Technologies for the Information Superhighway' Digest of Papers
Conference_Location :
Santa Clara, CA, USA
ISSN :
1063-6390
Print_ISBN :
0-8186-7414-8
Type :
conf
DOI :
10.1109/CMPCON.1996.501764
Filename :
501764
Link To Document :
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