DocumentCode
1728636
Title
A new thermomechanical fracture analysis approach for 3D integration technology
Author
Agwai, Abigail ; Guven, Ibrahim ; Madenci, Erdogan
Author_Institution
Aerosp. & Mech. Eng. Dept., Univ. of Arizona, Tucson, AZ, USA
fYear
2011
Firstpage
740
Lastpage
745
Abstract
In this study, the peridynamic framework is applied to model heat diffusion to derive peridynamic heat diffusion equations. A numerical scheme is put forward and implemented in order to establish the validity of these equations. Finally, an approach is developed for coupled solution of heat conduction and solid mechanics equations in the realm of peridynamics.
Keywords
heat conduction; integrated circuit packaging; three-dimensional integrated circuits; 3D integration technology; coupled solution; heat conduction; peridynamic framework; peridynamic heat diffusion equations; solid mechanics equations; thermomechanical fracture analysis approach; Equations; Finite element methods; Heating; Mathematical model; Solids; Steady-state;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-61284-497-8
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2011.5898595
Filename
5898595
Link To Document