• DocumentCode
    1728819
  • Title

    Fabrication and characterization of a liquid-metal micro-droplet thermal switch

  • Author

    Christensen, A.O. ; Jacob, J.P. ; Richards, C.D. ; Bahr, D.F. ; Richards, R.F.

  • Author_Institution
    Sch. of Mech. and Mater. Eng., Washington State Univ., Pullman, WA, USA
  • Volume
    2
  • fYear
    2003
  • Firstpage
    1427
  • Abstract
    This paper presents the development of a liquid metal micro-droplet array for use as a thermal switch. A method of producing arrays of mercury micro-droplets on a silicon substrate, which is compatible with batch manufacturing, is detailed. A technique for examining the deformation of the micro-droplets under an applied load is offered. For 30 /spl mu/m diameter droplets under deformation, contact diameters ranging from 0-30 /spl mu/m, and forces of 0-0.10 mN are examined. Predicted values of thermal contact resistance and experimental values of normalized heat transfer are presented as a function of applied load to the switch. Both predictions and experiment indicate that a thermal switch whose thermal resistance and heat transfer change by a factor of ten can be fabricated.
  • Keywords
    contact angle; contact resistance; deformation; drops; heat transfer; liquid metals; mercury (metal); microswitches; thermal resistance; 0 to 30 micron; Hg; Si; heat transfer; liquid metal microdroplet array; liquid metal microdroplet thermal switch; silicon substrate; thermal contact resistance; Batch production systems; Contacts; Fabrication; Heat transfer; Resistance heating; Silicon; Switches; Thermal factors; Thermal loading; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
  • Conference_Location
    Boston, MA, USA
  • Print_ISBN
    0-7803-7731-1
  • Type

    conf

  • DOI
    10.1109/SENSOR.2003.1217043
  • Filename
    1217043