Title :
Thermal based angle fixing for micromirrors
Author :
Jianglong Zhang ; Lee, Y.C.
Author_Institution :
Reflectivity Inc., Sunnyvale, CA, USA
Abstract :
This paper presents an angle fixing method used for micromirrors in the manufacturing misalignment adjustment system, such as laser-to-fiber coupling module. Micromirror devices with angle fixing by thermal fusion are first demonstrated. The experimental results of micromirrors with thermal based angle fixing are investigated and addressed. Three different angles are fixed with a maximum 0.10/spl deg/ angle change after the angle fixing. Finite element models with accurate material properties are developed to simulate the process. Guided by the model, the tilting angle shift can be reduced to 0.07/spl deg/ by changing microbridge and plate configurations.
Keywords :
bridge instruments; electrostatic actuators; elemental semiconductors; finite element analysis; micromirrors; modules; optical fibre couplers; silicon; wafer bonding; Si; electrostatic actuators; finite element models; laser-fiber coupling module; microbridge configuration; micromirrors; misalignment adjustment system manufacture; plate configuration; thermal based angle fixing; thermal fusion; tilting angle shift; wafer bonding; Costs; Fiber lasers; Laser modes; Micromirrors; Optical coupling; Optical fiber devices; Packaging; Pulp manufacturing; Silicon; Welding;
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
DOI :
10.1109/SENSOR.2003.1217054