Popcorn cracking in a plastic ball grid array package

Author

Shioda, Tsuyoshi ; Tanaka, Junsuke ; Hagimura, Atsushi

Author_Institution

Electron. & Recording Mater. Lab., Mitsui Chem. Inc., Yokahama, Japan

fYear

1998

Firstpage

200

Lastpage

204

Abstract

The preconditioning testing (85°C/85% RH or 6O% RH/168 hrs) for a plastic ball grid array (PBGA) package was carried out. The use of a substrate with relatively high rigidity at temperatures higher than 200°C resulted in improvement of the popcorn cracking resistance during IR reflow. This result was reasonably explained to be due to the relatively large compressive stress between chip and substrate induced by its high rigidity. Further improvement was observed by increasing the thickness of the solder resist (SR) or the Ag-filled die attach (DA) layer

Keywords

adhesives; ball grid arrays; humidity; integrated circuit packaging; internal stresses; microassembling; plastic packaging; printed circuit manufacture; printed circuit testing; reflow soldering; shear modulus; thermal stress cracking; thermal stresses; 168 hr; 200 C; 85 C; Ag; Ag-filled die attach layer thickness; IR reflow; PBGA package; chip-substrate compressive stress; plastic ball grid array package; popcorn cracking; popcorn cracking resistance; preconditioning testing; rigidity; solder resist thickness; substrate rigidity; Electronic equipment testing; Electronics packaging; Glass; Mechanical factors; Microassembly; Moisture; Plastic packaging; Resists; Strontium; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 2nd 1998

Conference_Location

Tokyo

Print_ISBN

0-7803-5090-1

Type

conf

DOI

10.1109/IEMTIM.1998.704621

Filename

704621