DocumentCode
1729687
Title
Tuning the quality factor of bulk micromachined structures using the squeeze film damping
Author
Ching-Chi Cheng ; Weileun Fang
Author_Institution
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume
2
fYear
2003
Firstpage
1590
Abstract
This study aims to demonstrate the possibility of tuning quality factor of a micromachined structure using the air damping of small squeeze film area (300 /spl mu/m/sup 2/ to 800 /spl mu/m/sup 2/). Two micromachining process has successfully been established to fabricate novel stationary structures using thin films and bulk silicon. Thus, the stationary structure and a vibrating micromachined cantilever will form the squeeze film region. According to the measurement, the quality factor of the vibrating beam remarkably dropped 65% when the squeeze film area increased from 0 /spl mu/m/sup 2/ to 800 /spl mu/m/sup 2/ under a 760 torr ambient pressure. Even when the ambient pressure was merely 20 mtorr, the quality factor of the beam still dropped 20% for the same case. The damping due to the squeeze film effect cannot be ignored even for a very small area. Consequently, the proposed stationary structures can be exploited to significantly alter the quality factor of dynamic systems.
Keywords
Q-factor measurement; elemental semiconductors; micromachining; micromechanical devices; semiconductor thin films; silicon; 20 torr; 760 torr; Si; air damping; micromachined structure; silicon; squeeze film damping; thin film; tuning quality factor; vibrating micromachined cantilever; Actuators; Area measurement; Damping; Microelectromechanical devices; Micromachining; Optical sensors; Q factor; Silicon; Tuning; Vibration measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7731-1
Type
conf
DOI
10.1109/SENSOR.2003.1217084
Filename
1217084
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