DocumentCode
1729756
Title
Extracting the conduction band offset in strained FinFETs from subthreshold-current measurements
Author
van Hemert, T. ; Kemaneci, B. Kaleli ; Hueting, R.J.E. ; Esseni, D. ; van Dal, M.J.H. ; Schmitz, J.
Author_Institution
MESA+ Inst. for Nanotechnol., Univ. of Twente, Enschede, Netherlands
fYear
2011
Firstpage
275
Lastpage
278
Abstract
Subthreshold measurements can reveal key device parameters. We present a method to identify the region of the transfer characteristic where the drain current is affected by neither parasitic off-state leakage nor strong inversion current. Then we employ this method to obtain the conduction band edge shift for FinFETs with various fin widths using temperature dependent transfer characteristics. The results indicate lowering of the conduction band edge up to 40 meV, and hence threshold voltage, for fin widths down to 5 nm. This is explained by the combination of quantum confinement and strain effect on the band edges. We demonstrate a qualitative agreement between measurements, theory and simulation.
Keywords
MOSFET; electric current measurement; conduction band edge shift; conduction band offset; drain current; parasitic off-state leakage; qualitative agreement; quantum confinement; strain effect; strained FinFET; subthreshold-current measurements; transfer characteristic; Current measurement; FinFETs; Logic gates; Silicon; Strain; Subthreshold current; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research Conference (ESSDERC), 2011 Proceedings of the European
Conference_Location
Helsinki
ISSN
1930-8876
Print_ISBN
978-1-4577-0707-0
Electronic_ISBN
1930-8876
Type
conf
DOI
10.1109/ESSDERC.2011.6044181
Filename
6044181
Link To Document