DocumentCode
1729808
Title
Vacuum underfill technology for advanced packaging
Author
Horibe, A. ; Paquet, M.-C. ; Gaynes, M. ; Feger, C. ; Sakuma, K. ; Knickerbocker, J.U. ; Orii, Y. ; Hoshiyama, M. ; Hasegawa, M. ; Sato, T. ; Yoshii, H. ; Suzuki, O. ; Kotaka, K. ; Nagasaka, T. ; Terada, K. ; Ishikawa, K. ; Hirayama, Y.
Author_Institution
IBM Res. - Tokyo, Tokyo, Japan
fYear
2011
Firstpage
1003
Lastpage
1008
Abstract
We developed vacuum assisted underfill technology for large die (>;18 × 18 mm) with fine pitch area array bumps (<; 150 μm pitch) to solve a critical underfill void issue. Material development and process optimization are the keys to realize a stable process for such an advanced package. It was also confirmed that the newly developed underfill materials have good reliability on the large die package.
Keywords
integrated circuit reliability; microassembling; optimisation; system-in-package; advanced packaging; die package; fine pitch area array bump; material development; process optimization; reliability; underfill void issue; vacuum assisted underfill technology; Adhesives; Delamination; Materials reliability; Substrates; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-61284-497-8
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2011.5898632
Filename
5898632
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