• DocumentCode
    1729971
  • Title

    Intrinsic temperature compensation of highly resistive high-Q silicon microresonators via charge carrier depletion

  • Author

    Samarao, Ashwin K. ; Ayazi, Farrokh

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2010
  • Firstpage
    334
  • Lastpage
    339
  • Abstract
    We report on a novel temperature compensation technique that exploits the dependence of TCF on the free charge carriers in silicon bulk acoustic resonators (SiBARs). The free charge carriers are considerably minimized by creating single and multiple pn-junction based depletion regions in the body of the resonator. The TCF of a highly resistive (>1000 Ω-cm) conventional rectangular SiBAR has been reduced from -32 ppm/°C to -3 ppm/°C. We previously exploited the dependence of TCF on silicon resonator geometry for TCF compensation. However, at large charge carrier depletion levels achieved in this work, the TCF is found to become independent of silicon resonator geometry.
  • Keywords
    acoustic resonators; bulk acoustic wave devices; charge compensation; elemental semiconductors; micromechanical resonators; silicon; Si; TCF dependence compensation; charge carrier depletion; free charge carriers; high resistive high-Q silicon microresonators; intrinsic temperature compensation technique; multiple pn-junction based depletion regions; rectangular SiBAR; silicon bulk acoustic resonators; silicon resonator geometry; temperature coefficient of frequency; Acoustics; Annealing; Charge carriers; Doping; Geometry; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frequency Control Symposium (FCS), 2010 IEEE International
  • Conference_Location
    Newport Beach, CA
  • ISSN
    1075-6787
  • Print_ISBN
    978-1-4244-6399-2
  • Type

    conf

  • DOI
    10.1109/FREQ.2010.5556315
  • Filename
    5556315