DocumentCode
1729971
Title
Intrinsic temperature compensation of highly resistive high-Q silicon microresonators via charge carrier depletion
Author
Samarao, Ashwin K. ; Ayazi, Farrokh
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2010
Firstpage
334
Lastpage
339
Abstract
We report on a novel temperature compensation technique that exploits the dependence of TCF on the free charge carriers in silicon bulk acoustic resonators (SiBARs). The free charge carriers are considerably minimized by creating single and multiple pn-junction based depletion regions in the body of the resonator. The TCF of a highly resistive (>1000 Ω-cm) conventional rectangular SiBAR has been reduced from -32 ppm/°C to -3 ppm/°C. We previously exploited the dependence of TCF on silicon resonator geometry for TCF compensation. However, at large charge carrier depletion levels achieved in this work, the TCF is found to become independent of silicon resonator geometry.
Keywords
acoustic resonators; bulk acoustic wave devices; charge compensation; elemental semiconductors; micromechanical resonators; silicon; Si; TCF dependence compensation; charge carrier depletion; free charge carriers; high resistive high-Q silicon microresonators; intrinsic temperature compensation technique; multiple pn-junction based depletion regions; rectangular SiBAR; silicon bulk acoustic resonators; silicon resonator geometry; temperature coefficient of frequency; Acoustics; Annealing; Charge carriers; Doping; Geometry; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium (FCS), 2010 IEEE International
Conference_Location
Newport Beach, CA
ISSN
1075-6787
Print_ISBN
978-1-4244-6399-2
Type
conf
DOI
10.1109/FREQ.2010.5556315
Filename
5556315
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