• DocumentCode
    1729978
  • Title

    On-chip high performance slow wave transmission lines using 3D steps for compact millimeter wave applications

  • Author

    Wang, Guoan ; Woods, Wayne ; Xu, Jason ; Mina, Essam

  • Author_Institution
    Semicond. R&D Center, IBM, Essex Junction, VT, USA
  • fYear
    2011
  • Firstpage
    1047
  • Lastpage
    1051
  • Abstract
    Slow wave coplanar waveguide structures have been designed and implemented with the 3D steps; include alternating high and low impedance sections. The high impedance section is built with a narrow (w1), thin (t1) short (s) line and designed to have line inductance nL; the low impedance section is built with wide (w1), thick (t1) short (s) line and is designed with line capacitance nC, where L and C are the line inductance and capacitance per unit length of the conventional transmission line with given characteristic impedance respectively. The slow wave transmission line structures were achieved through IBM 45 nm technology with multi-layer metals. Results for slow wave transmission lines are provided in the paper for design with different characteristics impedances. Results have shown that the inductance per unit length and capacitance per unit length of the line increased at least 40% compared with the conventional slow wave transmission line structure, which means a reduction of 30% wavelength and 50% chip area of a branch line coupler. The slow wave effect can be controlled by using different w1/w2, t1/t2 and s. In addition, detailed design guide to improve the slow wave effect are presented in the paper.
  • Keywords
    coplanar transmission lines; coplanar waveguides; millimetre wave couplers; slow wave structures; IBM technology; branch line coupler; characteristic impedance; compact millimeter wave applications; high impedance section; line inductance; low impedance sections; on-chip high performance slow wave transmission lines; size 45 nm; slow wave coplanar waveguide structures; Capacitance; Coplanar waveguides; Impedance; Inductance; Metals; Strips; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-61284-497-8
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2011.5898639
  • Filename
    5898639