Title :
The design of broadband 3D Si-based directional couplers for millimeter-wave/THz applications
Author :
Li, Jiankang ; Xiong, Yong-Zhong ; Hou, Debin ; Lim, Teck-Guan ; Min, Tang ; Goh, Wang Ling ; Wu, Wen
Author_Institution :
Nanjing Univ. of Sci. & Technol., Nanjing, China
Abstract :
Wideband directional couplers with high isolation are designed for millimeter-wave applications and implemented in two different in-house Si-based technologies processes - Si-benzocyclobutene (Si-BCB) process and LIGA-like process (lithography, electroplating, and molding). Two 3D tandem directional couplers for millimeter-wave/THz applications have been constructed using the Si-BCB process. The coupling and isolation of tandem coupler have been analyzed from circuit topology. A branch-line coupler is also constructed using the LIGA-like process. The electrical characteristics of these couplers have been simulated in 3D simulator. By comparing the results, the proposed Si-BCB process is noted to provide flexibilities in both the design and implementation of passive components.
Keywords :
LIGA; circuit simulation; electromagnetic coupling; elemental semiconductors; microwave isolators; millimetre wave directional couplers; network topology; silicon; terahertz wave devices; 3D simulator; 3D tandem directional coupler; LIGA-like process; Si; Si-BCB process; Si-based technology; Si-benzocyclobutene process; THz application; branch-line coupler; broadband 3D Si-based directional coupler; circuit topology; coupling; electrical characteristic; electroplating; high isolation; lithography; millimeterwave application; molding; tandem coupler isolation; wideband directional coupler; Couplings; Directional couplers; Millimeter wave communication; Silicon; Three dimensional displays;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2011.5898642
