Title :
A study on the 3D-TSV interconnection using wafer-level non-conductive adhesives (NCAs)
Author :
Choi, Yongwon ; Shin, Jiwon ; Paik, Kyung-Wook
Author_Institution :
Dept. of Mater. Sci. & Eng., KAIST, Daejeon, South Korea
Abstract :
In this study, the chip to chip eutectic bonding method of TSV stacking using various NCAs are investigated as an alternative chip to chip/wafer interconnection method for 3D-TSV application. The non-conductive polymer adhesives so called, TSV Conductive Adhesives (TCAs), are applied on the chip/wafer before bonding so that it acts like both adhesive and underfill. No additional underfill process is needed. The effects of material properties of TCAs such as curing behavior, and viscosity on the joint formation for 3D-TSV chip interconnection are investigated.
Keywords :
adhesive bonding; adhesives; three-dimensional integrated circuits; 3D-TSV chip interconnection; TSV conductive adhesives; TSV stacking; chip/wafer interconnection method; eutectic bonding; nonconductive polymer adhesives; wafer-level nonconductive adhesives; Bonding; Curing; Joints; Stacking; Temperature measurement; Through-silicon vias; Viscosity;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2011.5898651
