Title :
High temperature packaging for SAW transponder
Author :
Fachberger, R. ; Bardong, J.
Author_Institution :
Carinthian Tech Res. AG, CTR AG, Villach, Austria
Abstract :
A high temperature stable packaging for surface acoustic wave devices for application of radio frequency transponders in harsh environment was investigated. Several ceramic adhesives were tested and characterized for die bonding. The expected thermal stresses were calculated via finite elemente method. The adhesive forces were measured via shear tests after thermal aging of test samples up to temperatures of 850°C. The applicability of full functional Kovar based housings with ceramic to metal seals equipped with langasite devices was tested in-situ up to temperatures of 650°C.
Keywords :
finite element analysis; packaging; surface acoustic waves; transponders; Kovar based housings; SAW transponder; adhesive forces; ceramic adhesives; ceramic seals; die bonding; finite elemente method; high temperature packaging; langasite devices; metal seals; radio frequency transponders; surface acoustic wave devices; temperature 650 degC; temperature 850 degC; thermal stresses; Adhesives; Aging; Crystals; Force; Metals; Surface acoustic waves; Temperature measurement;
Conference_Titel :
Frequency Control Symposium (FCS), 2010 IEEE International
Conference_Location :
Newport Beach, CA
Print_ISBN :
978-1-4244-6399-2
DOI :
10.1109/FREQ.2010.5556325
