• DocumentCode
    1730370
  • Title

    Silicon integrated electronic-photonic ICs

  • Author

    Lo, Patrick ; Kwong, Dim-Lee

  • Author_Institution
    Inst. of Microelectron., A*STAR, Singapore, Singapore
  • fYear
    2010
  • Firstpage
    53
  • Lastpage
    54
  • Abstract
    Copper interconnect is unlikely to be the ultimate solution to support the growing functionalities of next generation microprocessor due to its information latency and power consumption. Converging EPIC on a single chip platform to enable functional diversification emerges as one promising approach to be realized by taking the advantage of low energy and huge data capacity of optical interconnects. In this presentation, we present an overview on the current status of this critical technology development and provide an outlook and strategies for the integration of Si micro- and nano-photonics to meet the bandwidth and energy requirements of data communication in future technology nodes.
  • Keywords
    integrated optics; integrated optoelectronics; micro-optics; nanophotonics; optical interconnections; silicon; Si; copper interconnect; data capacity; data communication; functional diversification; information latency; integrated electronic-photonic IC; microphotonics; microprocessor; nanophotonics; optical interconnects; power consumption; single chip platform; Optical device fabrication; Optical filters; Optical modulation; Optical ring resonators; Optical waveguides; Photonics; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical MEMS and Nanophotonics (OPT MEMS), 2010 International Conference on
  • Conference_Location
    Sapporo
  • Print_ISBN
    978-1-4244-8926-8
  • Electronic_ISBN
    978-1-4244-8925-1
  • Type

    conf

  • DOI
    10.1109/OMEMS.2010.5672189
  • Filename
    5672189