Title :
Two-chip pressure sensor and signal conditioning
Author :
Dancaster, J. ; Kim, W. ; Do, D. ; Sampson, S. ; Logan, J. ; Merrill, Robb
Author_Institution :
GE NovaSensor Inc., Fremont, CA, USA
Abstract :
This paper reports a newly developed tire pressure monitoring sensor (TPMS) incorporated with a digital sensor signal processing ASIC. The TPMS provides the compensated outputs of pressure, temperature, and battery voltage. The combination of the concise, cost-effective two-chip plastic package and the rigorous, simple calibration algorithm has been successfully adapted to this TPMS application. A calibration algorithm has been established from three characteristic equations with ten coefficients, obtained by relating the measured pressure, temperature and voltage ADC readings. The memory size of the algorithm firmware is less than 1Kbyte and as a result, the power consumption of this TPMS measurement is proven to be only 9.7 /spl mu/A-sec, which is well below the energy consumption that would allow a 10-year battery life. It has been successfully demonstrated that this TPMS meets the desired high-accuracy performance, providing the maximum pressure measurement errors less than 1.5% FSO over -40/spl deg/C to 125/spl deg/C and 2.1 VDC to 3.0 VDC battery voltage.
Keywords :
CMOS integrated circuits; analogue-digital conversion; application specific integrated circuits; digital signal processing chips; measurement errors; power consumption; pressure sensors; -40 to 125 degC; ADC readings; algorithm firmware; calibration algorithm; digital sensor signal processing ASIC; energy consumption; measurement errors; memory size; power consumption; pressure sensor; signal conditioning; tire pressure monitoring sensor; Battery charge measurement; Calibration; Digital signal processing; Energy consumption; Pressure measurement; Sensor phenomena and characterization; Signal processing algorithms; Temperature measurement; Tires; Voltage;
Conference_Titel :
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-7731-1
DOI :
10.1109/SENSOR.2003.1217111