• DocumentCode
    1730565
  • Title

    Four-mask process based on spacer technology for scaled-down lateral NEM electrostatic actuators

  • Author

    Lee, Daesung ; Lee, W. Scott ; Mitra, Subhasish ; Howe, Roger T. ; Wong, H. -S Philip

  • Author_Institution
    Stanford Univ., Stanford, CA, USA
  • fYear
    2010
  • Firstpage
    35
  • Lastpage
    36
  • Abstract
    This paper presents a four-mask fabrication process of lateral nanoelectromechanical (NEM) electrostatic actuators based on spacer technology. Critical dimensions of the actuators, i.e., the beam width and the gap size between the movable and fixed electrodes can be made smaller than the lithographic resolution by creating nitride spacers on an oxide hardmask followed by selective etching of the oxide hardmask. The combined oxide hardmask, nitride spacer, and another mask (photoresist mask) is then transferred to an underlying polysilicon structural layer to create lateral NEM electrostatic actuators with narrow beam and narrow gap.
  • Keywords
    electrostatic actuators; elemental semiconductors; etching; masks; nanoelectromechanical devices; photoresists; silicon; Si; beam width; four-mask fabrication process; gap size; lithographic resolution; nitride spacer; oxide hardmask; photoresist mask; polysilicon structural layer; scaled-down lateral NEM electrostatic actuators; selective etching; spacer technology; Electrodes; Electrostatic actuators; Etching; Lithography; Resists; Resonant frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical MEMS and Nanophotonics (OPT MEMS), 2010 International Conference on
  • Conference_Location
    Sapporo
  • Print_ISBN
    978-1-4244-8926-8
  • Electronic_ISBN
    978-1-4244-8925-1
  • Type

    conf

  • DOI
    10.1109/OMEMS.2010.5672196
  • Filename
    5672196