Title :
The future of 3D packaging
Author_Institution :
3D PLUS, France
Abstract :
Trends in interconnection techniques from 2D to 3D modules are presented. Historically, the different 3D interconnection techniques have been applied to memory modules for two reasons: market forces and simplicity. The development and manufacturing of 3D modules, firstly at Thomson-CSF from 1988 and subsequently at 3D PLUS from October 1995, addressed a variety of applications, including memory modules, calculation nodes, and microsystems. These different applications and perspectives are presented in this paper.
Keywords :
integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated memory circuits; micromechanical devices; multichip modules; 2D modules; 3D interconnection techniques; 3D modules; 3D packaging; calculation nodes; interconnection techniques; manufacturing; market forces; memory modules; microsystems; Costs; Electronics packaging; Frequency; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit reliability; Manufacturing; Microprocessors; Multichip modules; Packaging machines;
Conference_Titel :
IEMT/IMC Symposium, 2nd 1998
Conference_Location :
Tokyo, Japan
Print_ISBN :
0-7803-5090-1
DOI :
10.1109/IEMTIM.1998.704633
