Title :
Detection and characterization of defects in microelectronic packages and boards by means of high-resolution x-ray computed tomography (CT)
Author :
Pacheco, Mario ; Goyal, Deepak
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
In this paper a review of the development of x-ray computed tomography (CT) for non-destructive failure analysis in microelectronics packages and boards is presented. The general operation principle, key design considerations and technical challenges faced by x-ray CT technology are discussed. A comparison between 2D and 3D x-ray imaging capabilities is presented, and critical failure analysis case studies for first and second level interconnect that are hard or not possible to isolate by alternative methods are also discussed, as well as its unique progressive testing capability.
Keywords :
X-ray imaging; computerised tomography; electronics packaging; failure analysis; X-ray imaging; critical failure analysis; high-resolution X-ray computed tomography; microelectronic packages; nondestructive failure analysis; Computed tomography; Image reconstruction; Image resolution; Microelectronics; Soldering; Three dimensional displays; X-ray imaging;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2011.5898673
