DocumentCode
1730878
Title
Silicon micro heater based tagging module and the biocompatible packaging for capsule endoscope
Author
Ruiqi, Lim ; Chandrappan, Jayakrishnan ; Vaidyanathan, Kripesh ; Win, Shwe Sin
Author_Institution
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
fYear
2011
Firstpage
1300
Lastpage
1307
Abstract
Capsule endoscopes are widely used in gastro intestinal tract imaging. Current devices lack ways to precisely mark locations of interests during the image diagnose process. This paper presents a low-power micro heater module based on silicon technology, which can be integrated inside a capsule endoscope for precise localization. A custom polycarbonate capsule package is developed for both the tagging module and the capsule electronics. The complete system is then encapsulated with parylene thin film for biocompatibility purpose, which is analyzed in this study.
Keywords
biomedical electronics; electronics packaging; elemental semiconductors; endoscopes; low-power electronics; modules; silicon; thin films; Si; biocompatible packaging; capsule electronics; capsule endoscope; custom polycarbonate capsule package; gastrointestinal tract imaging; image diagnose process; low-power microheater module; parylene thin film; tagging module; Biomedical imaging; Coatings; Endoscopes; Heating; Latches; Resists; Tagging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-61284-497-8
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2011.5898679
Filename
5898679
Link To Document