DocumentCode :
173088
Title :
Simulation modeling and visualization of start-up transient processes of dual-arm cluster tools with wafer revisiting
Author :
ChunRong Pan ; Mengchu Zhou ; Yan Qiao ; NaiQi Wu
Author_Institution :
Dept. of Mechatornics Eng., Jiangxi Univ. of Sci. & Technol., Ganzhou, China
fYear :
2014
fDate :
5-8 Oct. 2014
Firstpage :
133
Lastpage :
138
Abstract :
The trends of increasing wafer diameter and smaller lot sizes from 25 wafers to a few wafers have led to more transient periods in wafer fabrication, thereby requiring more research on the optimal execution of transient processes. For some wafer fabrication processes, such as atomic layer deposition (ALD), wafers need to visit some process modules for a number of times, instead of once, thus leading to a so-called revisiting process. Research on transient processes of dual-arm cluster tools with wafer revisit processes becomes urgently needed for high-performance wafer fabrication. A cluster tool has no buffer except its robot, which makes its scheduling difficult. Thus, in order to study a cluster tool with revisiting process, a simulation system is helpful. This work develops a simulation model and system for a dual-arm cluster tool with a wafer revisit by using eM-Plant as a simulation platform. The resultant simulation system can be used for analysis and optimization of transient processes. An illustrative example is given to show its applications.
Keywords :
optimisation; production engineering computing; semiconductor industry; semiconductor technology; simulation; dual-arm cluster tools; eM-Plant simulation software; semiconductor manufacturing system; start-up transient process optimization; wafer fabrication; wafer revisit processes; Fabrication; Object oriented modeling; Robots; Schedules; Semiconductor device modeling; Steady-state; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Systems, Man and Cybernetics (SMC), 2014 IEEE International Conference on
Conference_Location :
San Diego, CA
Type :
conf
DOI :
10.1109/SMC.2014.6973896
Filename :
6973896
Link To Document :
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