Packaging of Ka-band patch antenna and optoelectronic components for dual-mode indoor wireless communication

Author

Liao, Jun ; Wu, Pengfei ; Mirvakili, Ali ; Joyner, Valencia ; Huang, Z. Rena

Author_Institution

ECSE Dept., Rensselaer Polytech. Inst., Troy, NY, USA

fYear

2011

Firstpage

1338

Lastpage

1343

Abstract

In this paper, we present a RF/FSO dual mode communication module formed by a Ka-band patch antenna and optoelectronic components. A LED and a PiN diode are bonded on the patch antenna as the front-end transceiver of the FSO communication channel. The patch antenna is modified to accommodate LED/PiN assembly with minimized crosstalk between the RF channel and the optical channel. Both the simulation and the experimental measurement validate that the interference between the Ka-band RF signals and the visible/infra-red optical signal is negligible. This new module can achieve 5 Gbps end-to-end FSO data transmission with RF channel backup.

Keywords

electronics packaging; indoor communication; light emitting diodes; microstrip antennas; optical transceivers; p-i-n diodes; Ka-band patch antenna; LED; PiN diode; RF channel backup; RF-FSO dual mode communication module; bit rate 5 Gbit/s; dual-mode indoor wireless communication; end-to-end transmission; free space optical communication; front-end transceiver; optical channel; optoelectronic components; packaging; visible-infrared optical signal; Antenna measurements; Antenna radiation patterns; Bonding; Optical transmitters; Patch antennas; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

978-1-61284-497-8

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2011.5898685

Filename

5898685