Design of a miniaturized single package radio solution for dual band Wi-MAX module

Recent advances in Integration technology and device performance paved the way for higher level of System On Chip (SOC) or In Package (SIP). Complete front end radio for Wi-MAX systems includes several blocks, RFIC transceiver, Power Amplifier (PA), and front end module (FEM) blocks in addition to control circuitry and matching components and de-coupling capacitor. The electrical performance of each block dictates the technology of choice to achieve the stringent system performance requirements. In the present state of the art systems, Si CMOS, Si or SiGe BiCMOS, GaAs HBT, and GaAs PHEMT are used for IC implementation, while ceramic, LTCC, Si or Glass are employed for passive components and circuits plus packaging. So hybrid solution that blends SOC and SIP might be the only viable approach, at the present time to achieve the desired level of integration for complete front end radio in a single package radio. The single package radio is capable of mixing and matching different technologies based upon lower cost, smallest size, and lowest power consumption assuming the system specification is satisfied by default.