DocumentCode
1731038
Title
Characteristics of high performance PFETs with embedded SiGe source/drain and <100> channels on 45° rotated wafers
Author
Ouyang, Qiqing Christine ; Ieong, Meikei ; Fischetti, Massimo ; Panda, Siddhartha ; Boyd, Diane ; Rim, Ken ; Ott, John A.
Author_Institution
IBM Semicond. R&D Center, T. J Watson Res. Center, Yorktown Heights, NY, USA
fYear
2005
Firstpage
27
Lastpage
28
Abstract
PFETs with embedded-eSiGe S/D are demonstrated for the first time on rotated wafers with <100> channels. Improved short-channel behavior is achieved. The performance variation is reduced because hole mobility is less sensitive to both transverse and longitudinal stress. Hence, embedded SiGe on rotated wafers have improved robustness for short-channel pFETs.
Keywords
Ge-Si alloys; MOSFET; hole mobility; SiGe; embedded-eSiGe source/drain; hole mobility; longitudinal stress; rotated wafers; short-channel behavior; short-channel pFET; transverse stress; CMOS process; CMOS technology; Compressive stress; Degradation; Germanium silicon alloys; Isolation technology; Microelectronics; Research and development; Robustness; Silicon germanium;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 2005. (VLSI-TSA-Tech). 2005 IEEE VLSI-TSA International Symposium on
ISSN
1930-8868
Print_ISBN
0-7803-9058-X
Type
conf
DOI
10.1109/VTSA.2005.1497068
Filename
1497068
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