A novel compact antenna with a low profile demonstrated on embedded wafer level packaging (EMWLP) technology

In an RF front-end module, the reduction of the antenna size is a challenge since it is dependent on the frequency of operation. In this paper, a method of antenna miniaturization is introduced, by employing a novel meander CPWG feed structure as well as reducing the footprints of both radiating structure and the feed structure. In one of the proposed structures, the bandwidth can be enhanced by introducing a slotted ground plane for better matching. The structures are fabricated on cost-effective platforms using embedded wafer level packaging (EMWLP) and FR-4 laminates, with a compact footprint and low profile achieved.