Post-packaging tuning of microresonators by pulsed laser deposition

Author

Chiao, M. ; Lin, L.

Author_Institution

Intpax, Inc., San Jose, CA, USA

Volume

2

fYear

2003

Firstpage

1820

Abstract

This paper presents a post-packaging tuning process for microresonators by PLD (Pulsed Laser Deposition). The microresonators are first hermetically packaged using the RTP (Rapid Thermal Processing) aluminum-to-silicon nitride bonding process. The resonator mass is then altered by adding materials on the surface of the structure using PLD to achieve the desired resonant frequency. The demonstrated tuning resolution is 0.5 % per laser shot with the laser beam spot size of 25/spl times/25 /spl mu/m/sup 2/, energy of 587 mJ/cm/sup 2/, pulse duration of 6 nano second, and 0.35 /spl mu/m-thick gold film as the deposition material for comb-drive microresonators resonating at 12.45 KHz.

Keywords

aluminium; gold; laser beam effects; microcavities; micromechanical resonators; pulsed laser deposition; rapid thermal processing; silicon compounds; thin films; 0.35 micron; 12.45 kHz; 6 ns; Al-SiN; Au; PLD; RTP; aluminum-to-silicon nitride bonding; gold film; laser beam spot size; microresonators; post-packaging tuning; pulsed laser deposition; rapid thermal processing; resonator mass; Bonding processes; Hermetic seals; Laser tuning; Microcavities; Optical materials; Optical pulses; Packaging; Pulsed laser deposition; Rapid thermal processing; Resonant frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-7731-1

Type

conf

DOI

10.1109/SENSOR.2003.1217141

Filename

1217141