• DocumentCode
    1731311
  • Title

    An analytical model for the thermoelastic actuation of composite diaphragms

  • Author

    Chandrasekaran, V. ; Sankar, B.V. ; Cattafesta, L.N. ; Nishida, T. ; Sheplak, M.

  • Author_Institution
    Dept. of Mech. & Aerosp. Eng., Florida Univ., Gainesville, FL, USA
  • Volume
    2
  • fYear
    2003
  • Firstpage
    1844
  • Abstract
    An analytical model for the thermoelastic actuation of a circular composite diaphragm is presented. The model incorporates several key aspects relevant to micromachined thermoelastic resonators including multiple material layers, in-plane heat conduction and fabrication-induced stresses. Using a Fourier heat conduction model, expressions for the 2-D temperature distribution in the composite diaphragm generated by the dynamic Joule heating of diffused resistors are obtained via Hankel transforms and Green´s functions. The thermoelastically forced vibration of the composite diaphragm is analyzed using classical Kirchoff plate theory and solved to obtain expressions for the transverse diaphragm deflection. Comparisons of the analytical model with coupled thermal-mechanical finite element simulations show excellent agreement with significantly faster (80/spl times/) computation time.
  • Keywords
    Green´s function methods; Hankel transforms; composite materials; diaphragms; heat conduction; microactuators; piezoresistive devices; resistors; temperature distribution; thermoelasticity; 2D temperature distribution; Fourier heat conduction model; Greens functions; Hankel transforms; analytical model; circular composite diaphragm; classical Kirchoff plate theory; dynamic Joule heating; heat conduction; micromachined thermoelastic resonators; multiple material layers; resistors; thermal-mechanical finite element simulations; thermoelastic actuation; thermoelastically forced vibration; transverse diaphragm deflection; Analytical models; Conducting materials; Finite element methods; Fourier transforms; Green´s function methods; Heating; Resistors; Temperature distribution; Thermal stresses; Thermoelasticity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
  • Conference_Location
    Boston, MA, USA
  • Print_ISBN
    0-7803-7731-1
  • Type

    conf

  • DOI
    10.1109/SENSOR.2003.1217147
  • Filename
    1217147