• DocumentCode
    1731657
  • Title

    Free-air ball formation and deformability with Pd coated Cu wire

  • Author

    Rezvani, A. ; Mayer, M. ; Shah, A. ; Zhou, N. ; Hong, S.J. ; Moon, J.T.

  • Author_Institution
    Microjoining Lab., Univ. of Waterloo, Waterloo, ON, Canada
  • fYear
    2011
  • Firstpage
    1516
  • Lastpage
    1522
  • Abstract
    With 20μm diameter PCC wire, spherical (well-shaped) free-air balls (FABs) were obtained in both forming gas and N2 at flow rates between 0.25-0.75 l/min and 0.4-0.5 l/min, respectively. With Cu wire, in comparison, sperical FAB are obtained in forming gas with flow rates between 0.25 and 0.5 l/min while in N2 gas, FABs are always pointed or golf-clubbed (mis-shaped). Using a shielding gas with Au wire makes the FABs mis-shaped. The FAB deformability is measured as the amount of deformation under a given load. Au had the highest deform-ability. The FABs made with PCC wire in N2 had generally the same deformability as Cu FABs in forming gas. The force required to achieve a pre-defined deformed ball height (target) is named “force for target deformation”, FTD, and set to half the FAB diameter. Compared to "deformability", the FTD method is more similar to the standard tensile or compression tests that determine yield strength. Deforming a PCC FAB obtained with 0.4 1/min N2 to the target ball height requires 615 ± 32 mN, a value not significantly different from that for a Cu FAB obtained in 5 l/min forming gas. For comparison, the target deformation requires 394 ± 16 mN for a Au FAB.
  • Keywords
    copper; lead bonding; palladium; plastic deformation; tensile testing; yield strength; FAB deformability; PCC wire; Pd-Cu; compression tests; force for target deformation; forming gas; palladium coated copper wire; shielding gas; size 20 mum; spherical free-air ball formation; tensile tests; yield strength; Bonding; Copper; Correlation; Force; Gold; Manganese; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-61284-497-8
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2011.5898711
  • Filename
    5898711