• DocumentCode
    1731779
  • Title

    A micromachined Knudsen pump for on-chip vacuum

  • Author

    McNamara, S. ; Gianchandani, Y.B.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
  • Volume
    2
  • fYear
    2003
  • Firstpage
    1919
  • Abstract
    This paper describes a single-chip micromachined implementation of a Knudsen pump-a type of vacuum pump that works by the principle of thermal transpiration, has no moving parts, and consequently offers high reliability. A 6-mask process was used to fabricate the pump from a glass substrate and a silicon wafer. A single stage pump and two integrated pressure sensors occupy 1.5 mm/spl times/2 mm. Measurements show that this device can evacuate a cavity to 0.46 atm while operating at atmospheric pressure and using 80 mW input power. Temperature measurements show thermal isolation on the order of 10/sup 4/ K/W between the polysilicon heater used to operate the pump and the rest of the device.
  • Keywords
    Knudsen flow; elemental semiconductors; masks; micropumps; microsensors; pressure sensors; silicon; transpiration; vacuum pumps; 0.46 atm; 80 mW; Si; glass substrate; mask; micromachined Knudsen pump; on-chip vacuum; polysilicon heater; pressure sensor; silicon wafer; thermal isolation; thermal transpiration; Gases; Geometry; Gettering; Heat pumps; Helium; Rough surfaces; Spectroscopy; Surface roughness; Temperature; Thermal engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
  • Conference_Location
    Boston, MA, USA
  • Print_ISBN
    0-7803-7731-1
  • Type

    conf

  • DOI
    10.1109/SENSOR.2003.1217167
  • Filename
    1217167