Through silicone vias: Multilayer interconnects for stretchable electronics

We show how stretchable Poly(dimethylsiloxane) (PDMS) electrically conductive composites (ECC) can be fabricated to form flexible, stretchable multilayer interconnects. Multilayer integration through via-like structures enables increased component interconnection and reduced form factor. We show a unique process for forming stretchable multilayer interconnects in PDMS via a bench-top layer-by-layer assembly technique. The SCC is reliable under bending, tensile (ε=0.3) and compressive strains. Furthermore, we show how the processes and package designs developed can be applied to the fabrication of stretchable devices. The techniques presented to fabricate ultra-low cost, stretchable, 3D packages hold the potential serve as a package for future stretchable electronic and radio frequency devices.