DocumentCode
1731941
Title
Extremely-scaled double-gate CMOS with non-self-aligned back gate
Author
Kim, Keunwoo ; Hanafi, H.I. ; Cai, Jin ; Chuang, Ching-Te
Author_Institution
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2005
Firstpage
110
Lastpage
111
Abstract
This paper presents the possibly viable concept of extremely-scaled but non-self-aligned planar DG CMOS technology that, irrespective of moderate back-gate underlap, can still yield high performance and low leakage with good control of short-channel effects (SCEs). The pragmatic design exploits the inherent beneficial features of both asymmetrical and symmetrical DG FETs as presented in H.S.P Wong et al. (1994), H. Hanafi et al. (2003), E. J. Nowak et al. (2004) and K. Kim and J. G. Fossum (2001), as well as the flexibility in their structural design. Off-state current (loff) reduction by reverse back-gate bias in DG device is studied and compared with the reverse body bias based in A. Keshavarzi et al. (2001) in bulk-Si counterpart.
Keywords
CMOS integrated circuits; leakage currents; asymmetrical DG FET; bulk-Si devices; current reduction; extremely-scaled double-gate CMOS; nonself-aligned back gate; reverse back-gate bias; short-channel effects; Back; CMOS technology; Circuit optimization; Degradation; FETs;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 2005. (VLSI-TSA-Tech). 2005 IEEE VLSI-TSA International Symposium on
ISSN
1930-8868
Print_ISBN
0-7803-9058-X
Type
conf
DOI
10.1109/VTSA.2005.1497100
Filename
1497100
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