DocumentCode :
1731941
Title :
Extremely-scaled double-gate CMOS with non-self-aligned back gate
Author :
Kim, Keunwoo ; Hanafi, H.I. ; Cai, Jin ; Chuang, Ching-Te
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2005
Firstpage :
110
Lastpage :
111
Abstract :
This paper presents the possibly viable concept of extremely-scaled but non-self-aligned planar DG CMOS technology that, irrespective of moderate back-gate underlap, can still yield high performance and low leakage with good control of short-channel effects (SCEs). The pragmatic design exploits the inherent beneficial features of both asymmetrical and symmetrical DG FETs as presented in H.S.P Wong et al. (1994), H. Hanafi et al. (2003), E. J. Nowak et al. (2004) and K. Kim and J. G. Fossum (2001), as well as the flexibility in their structural design. Off-state current (loff) reduction by reverse back-gate bias in DG device is studied and compared with the reverse body bias based in A. Keshavarzi et al. (2001) in bulk-Si counterpart.
Keywords :
CMOS integrated circuits; leakage currents; asymmetrical DG FET; bulk-Si devices; current reduction; extremely-scaled double-gate CMOS; nonself-aligned back gate; reverse back-gate bias; short-channel effects; Back; CMOS technology; Circuit optimization; Degradation; FETs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 2005. (VLSI-TSA-Tech). 2005 IEEE VLSI-TSA International Symposium on
ISSN :
1930-8868
Print_ISBN :
0-7803-9058-X
Type :
conf
DOI :
10.1109/VTSA.2005.1497100
Filename :
1497100
Link To Document :
بازگشت