Title :
Encapsulated MEMS resonators — A technology path for MEMS into Frequency Control applications
Author :
Kim, B. ; Melamud, R. ; Candler, R.A. ; Hopcroft, M.A. ; Jha, C.M. ; Chandorkar, S. ; Kenny, T.W.
Author_Institution :
Departments of Mechanical and Electrical Engineering, Stanford University, CA 94305, USA
Abstract :
MEMS resonators have been discussed as replacements for quartz crystals in electronics timing applications for more than 40 years. The emergence of high-quality, low-cost packaging for MEMS resonators has enabled the first demonstrations of long-term stability and opened the door for commercial applications.
Keywords :
Bonding; Coatings; Encapsulation; Glass; Micromechanical devices; Sealing materials;
Conference_Titel :
Frequency Control Symposium (FCS), 2010 IEEE International
Conference_Location :
Newport Beach, CA, USA
Print_ISBN :
978-1-4244-6399-2
DOI :
10.1109/FREQ.2010.5556386
