Title :
Effects of bonding parameters and ACF material properties on the ACF joint morphology in ultrasonic bonding
Author :
Kim, Yoo-Sun ; Lee, Kiwon ; Kim, Won-Chul ; Paik, Kyung-Wook
Author_Institution :
Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
Abstract :
In this study, effects of bonding parameters and ACF material properties on the ACF joint morphology were investigated to understand influencing factors for a stable ACF joint in US bonding. According to the experimental results, the morphology of acrylic-based ACFs with 8 um diameter particles significantly changed as the bonding parameters changed due to high viscosity and fast curing rate. However, epoxy-based ACFs showed similar joint morphologies regardless of bonding parameters due to low viscosity and slow curing rate. As the bonding temperature increased from 150°C to 250°C, ACF joint gaps of the acrylic-based ACFs increased up to 12 um due to a smaller resin flow by a faster curing rate at higher temperatures. At 200°C constant bonding temperature, the ACF joint gaps decreased from 7 um to 2 um with increasing bonding pressure in the range of 2MPa to 4MPa due to a larger resin flow at higher bonding pressures. This result indicates that higher bonding pressure is desirable for high-speed bonding at high temperatures using acrylic-based ACFs. However, Acrylic-based ACFs with 20 um diameter particles can be a simple solution for high-speed bonding because they showed stable particle contacts due to a large particle size than ACF joint gaps regardless of bonding parameters.
Keywords :
ultrasonic bonding; ACF joint morphology; ACF material properties; anisotropic conductive film; bonding parameters; temperature 150 degC to 250 degC; ultrasonic bonding; Acoustics; Bonding; Curing; Joints; Morphology; Resins; Viscosity;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2011.5898778