• DocumentCode
    1733568
  • Title

    Analysis of Retention Time Distribution of Embedded DRAM - A New Method to Characterize Across-Chip Threshold Voltage Variation

  • Author

    Kong, W. ; Parries, P.C. ; Wang, G. ; Iyer, S.S.

  • Author_Institution
    IBM Semicond. R&D Center, Hopewell, VA
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    In this paper, we investigate the retention time distribution of IBM´s 65nm node embedded DRAM. We demonstrate that subthreshold current is the dominant leakage mechanism that determines data retention time, and the retention distribution can be attributed to array Vt variation. Based on this study, we present a new technique for characterization of across-chip Vt variation. The Vt median value and standard deviation of transfer devices within an eDRAM array are estimated by analyzing the retention characteristics. The evaluation results are confirmed by the parametric test data. The proposed method is fast and can be used to monitor Vt variation in both technology development and manufacture. The impact of array Vt spread on the retention and performance of eDRAM is discussed.
  • Keywords
    DRAM chips; IBM; across-chip threshold voltage variation; data retention time; eDRAM array; embedded DRAM; retention time distribution; subthreshold current; Circuit testing; FETs; Gain measurement; Manufacturing; Monitoring; Random access memory; Scattering; Statistics; Subthreshold current; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2008. ITC 2008. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-2402-3
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2008.4700556
  • Filename
    4700556