DocumentCode
1733568
Title
Analysis of Retention Time Distribution of Embedded DRAM - A New Method to Characterize Across-Chip Threshold Voltage Variation
Author
Kong, W. ; Parries, P.C. ; Wang, G. ; Iyer, S.S.
Author_Institution
IBM Semicond. R&D Center, Hopewell, VA
fYear
2008
Firstpage
1
Lastpage
7
Abstract
In this paper, we investigate the retention time distribution of IBM´s 65nm node embedded DRAM. We demonstrate that subthreshold current is the dominant leakage mechanism that determines data retention time, and the retention distribution can be attributed to array Vt variation. Based on this study, we present a new technique for characterization of across-chip Vt variation. The Vt median value and standard deviation of transfer devices within an eDRAM array are estimated by analyzing the retention characteristics. The evaluation results are confirmed by the parametric test data. The proposed method is fast and can be used to monitor Vt variation in both technology development and manufacture. The impact of array Vt spread on the retention and performance of eDRAM is discussed.
Keywords
DRAM chips; IBM; across-chip threshold voltage variation; data retention time; eDRAM array; embedded DRAM; retention time distribution; subthreshold current; Circuit testing; FETs; Gain measurement; Manufacturing; Monitoring; Random access memory; Scattering; Statistics; Subthreshold current; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2008. ITC 2008. IEEE International
Conference_Location
Santa Clara, CA
ISSN
1089-3539
Print_ISBN
978-1-4244-2402-3
Electronic_ISBN
1089-3539
Type
conf
DOI
10.1109/TEST.2008.4700556
Filename
4700556
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